Turning to optical I/O to open up computing pinch points

Getting data in and out of chips used for modern computing has become a key challenge for designers.

Hugo Saleh

A chip may talk to a neighbouring device in the same platform or to a chip across the data centre.

The sheer quantity of data and the reaches involved - tens or hundreds of meters - is why the industry is turning to optical for a chip’s input-output (I/O).

It is this technology transition that excites Ayar Labs.

The US start-up showcased its latest TeraPHY optical I/O chiplet operating at 1 terabit-per-second (Tbps) during the OFC virtual conference and exhibition held in June.

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Ayar Labs’ TeraPhy chiplet nears volume production

Moving data between processing nodes - whether servers in a data centre or specialised computing nodes used for supercomputing and artificial intelligence (AI) - is becoming a performance bottleneck.

Workloads continue to grow yet networking isn’t keeping pace with processing hardware, resulting in the inefficient use of costly hardware.

Networking also accounts for an increasing proportion of the overall power consumed by such computing systems.

These trends explain the increasing interest in placing optics alongside chips and co-packaging the two to boost input-output (I/O) capacity and reach.

At the ECOC 2020 exhibition and conference held virtually, start-up Ayar Labs showcased its first working TeraPHY, an optical I/O chiplet, manufactured using GlobalFoundries’ 45nm silicon-photonics process.

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Xilinx’s Versal Premium ready for the 800-gigabit era

When Xilinx was created in 1984, the founders banked on programmable logic becoming ever more attractive due to Moore’s law.

Making logic programmable requires extra transistors so Xilinx needed them to become cheaper and more plentiful, something Moore’s law has delivered, like clockwork, over decades.

Kirk SabanSince then, Xilinx’s field-programmable gate array (FPGA) devices have advanced considerably.

Indeed, Xilinx’s latest programmable logic family, the Versal Premium, is no longer referred to as an FPGA but as an adaptive compute accelerator platform (ACAP).

The Versal Premium series of chips, to be implemented using TSMC’s 7nm CMOS process, was unveiled for the OFC 2020 show. The Premium series will have seven chips with the largest, the VP1802, having 50 billion transistors.

First devices will ship in the second half of 2021.

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Inphi unveils first 800-gigabit PAM-4 signal processing chip

Inphi has detailed what it claims is the industry’s first digital signal processor (DSP) chip family for 800-gigabit client-side pluggable modules. 

Dubbed Spica, the 4-level pulse-amplitude modulation (PAM-4) DSP family is sampling and is in the hands of customers.

Source: Inphi

The physical-layer company has also announced its third-generation Porrima family of PAM-4 DSPs for 400-gigabit pluggables. 

The Porrima DSP with integrated laser driver has being made using a 7nm CMOS process; until now a 16nm CMOS has been used. Fabricating the chip using the more advanced process will reduce the power consumption of 400-gigabit module designs. 

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PCI Express back on track with latest specifications

Richard Solomon and Scott Knowlton are waiting for me in the lobby of a well-known Tel-Aviv hotel overseeing the sunlit Mediterranean Sea.  

Richard SolomonSolomon, vice chair of the PCI Special Interest Group (PCI-SIG), and Knowlton, its marketing working group co-chair, are visiting Israel to deliver a training event addressing the PCI Express (PCIe) high-speed serial bus standard. 

With over 750 member companies, PCI-SIG conducts several training events around the world each year. The locations are chosen where there is a concentration of companies and engineers undertaking PCIe designs. “These are chip, board and systems architects,” says Solomon. 

PCI-SIG has hit its stride after a prolonged quiet period. The group completed the PCIe 4.0 standard in 2017, seven years after it launched PCIe 3.0. The PCIe 4.0 doubles the serial bus speed and with the advent of PCIe 5.0, it will double again.

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