Rockley Photonics showcases its in-packaged design at OFC

Rockley Photonics has showcased its in-packaged optics design to select customers and development partners at the OFC show being held in San Diego this week.

The packaged design includes Rockley's own 2 billion transistor layer 3 router chip, and its silicon photonics-based optical transceivers. The layer 3 router chip, described as a terabit device, also includes mixed-signal circuits needed for the optical transceevers' transmit and receive paths.

 Source: Rockley Photonics (annotated by Gazettabyte).Rockley says it is using 500m-reach PSM4 transceivers for the design and that while a dozen ribbon cables are shown, this does not mean there are 12 100-gigabit PSM4 transceivers. The company is not saying what the total optical input-output is. 

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DustPhotonics reveals its optical transceiver play

A start-up that has been active for a year has dropped its state of secrecy to reveal it is already shipping its first optical transceiver product.

The company, DustPhotonics, is backed by private investors and recently received an undisclosed round of funding that will secure the company’s future for the next two years.  

Product plans

DustPhotonics' first product is the multi-mode 100m-reach 100GBASE-SR4 QSFP28. The company will launch its first 400-gigabit optical modules later this year. 

Ben Rubovitch

“We probably are going to be one of the first to market with [400-gigabit] QSFP-DD and OSFP multi-mode solutions,” says Ben Rubovitch, CEO of DustPhotonics.

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