Enabling 800-gigabit optics with physical layer ICs

Broadcom recently announced a family of 800-gigabit physical layer (PHY) chips. The device family is the company’s first 800-gigabit ICs with 100-gigabit input-output (I/O) interfaces.

Source: Broadcom

Moving from 50-gigabit to 100-gigabit-based I/O enables a new generation of 800-gigabit modules aligned with the latest switch chips.

“With the switch chip having 100-gigabit I/Os, PHYs are needed with the same interfaces,” says Machhi Khushrow, senior director of marketing, physical layer products division at Broadcom.

Broadcom’s latest 25.6 terabit-per-second (Tbps) Tomahawk 4 switch chip using 100-gigabit I/O was revealed at the same time.

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Broadcom’s 14.4-terabit Jericho2c+ router chip

The inexorable growth of IP traffic is being driven by ever more powerful devices being connected to the network and greater numbers of machines talking to each other.

In turn, Covid-19 has contributed its own traffic spike: AT&T reported that in September its core network traffic was 20 per cent up compared to March’s figures.

Jericho2c+ architecture. Source: Broadcom

The growth means that each new generation of router platform must at least double the traffic throughput while keeping the power consumption fixed.

This is a considerable challenge but one that the router chip designers continue to meet.

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Ranovus outlines its co-packaged optics plans

Part 2: Odin technology

Ranovus has tested a chiplet that combines electronics and silicon photonics. Dubbed Odin 8, the monolithic design is targetting the co-packaged optics opportunity, enabling silicon chips to communicate optically.

The company is developing two such chiplets: the 800-gigabit Odin 8 and the higher-capacity Odin 32 that supports 3.2 terabits of traffic. 

Hamid Arabzadeh 

The first use of Odin 8 will be for 800-gigabit client-side modules. “We already have three lead customers for our 800-gigabit module business,” says Hamid Arabzadeh, CEO of Ranovus.

The 800-gigabit pluggable modules using the Odin 8 are expected to be generally available from late 2021.

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Trident 4 boosts enterprise switch capacity to 12.8 terabit

• Broadcom’s Trident 4 switch chip has a capacity of 12.8 terabits, 4x the capacity of its Trident 3.
• The chip reduces fourfold the cost of a 128x100-gigabit switch.  
• The Trident 4 adds compiler programmability  
• This is the company’s first switch chip in 7nm CMOS. 

Broadcom has unveiled the Trident 4, its latest family of switch chips for the enterprise. 

The largest-capacity Trident 4 family member, the X11 chip, has a switching capacity of 12.8 terabits. This is a fourfold increase in capacity compared to Broadcom’s current high-end enterprise chip, the Trident 3, announced in June 2017.  

The Trident 4 will also reduce the cost of a 128x100-gigabit switch by a factor of four. The current cost of a 12.8-terabit switch, a multi-chassis solution, is $245,000 not including the pluggable optics, says Broadcom, citing market research firm, The Dell’Oro Group.

“The announcement is significant both in updating the Trident line for enterprise and in adding compiler programmability thereby limiting the openings for competitors such as Barefoot - soon Intel - Innovium, and Marvell,” says Bob Wheeler, vice president of The Linley Group and principal analyst for networking.

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Co-packaged optics to debut with 25.6 terabit switch chips

The second article in a series on co-packaged optics.

Part 2: Broadcom - a switch-chip vendor 

The hyperscalers require ever more switching capacity in their data centres to scale the applications they run. A hierarchy of connected switches fitted with optical interfaces is used to provide the pathways that link the tens of thousands of servers found in data centres.

Silicon vendors are responding to this need by doubling the capacity of their switch chips every two years. The largest switch chips have a 12.8-terabit capacity and the first 25.6-terabit devices are expected next year. This relentless pace, however, is one that the optical module makers are struggling to match. 

Source: Gazettabyte

“It is a problem for the optics industry,” says Robert Stone, Distinguished Engineer at leading switch chip player, Broadcom. “The cadence at which we can evolve silicon generally moves a lot faster than the optics guys can monetise a generation of investment, and then reinvest it.”

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Switch chips not optics set the pace in the data centre

Broadcom is doubling the capacity of its switch silicon every 18-24 months, a considerable achievement given that Moore’s law has slowed down. 

Last December, Broadcom announced it was sampling its Tomahawk 3 - the industry’s first 12.8-terabit switch chip - just 14 months after it announced its 6.4-terabit Tomahawk 2.

Rochan SankarSuch product cycle times are proving beyond the optical module makers; if producing next-generation switch silicon is taking up to two years, optics is taking three, says Broadcom. 

“Right now, the problem with optics is that they are the laggards,” says Rochan Sankar, senior director of product marketing at switch IC maker, Broadcom. “The switching side is waiting for the optics to be deployable.”

The consequence, says Broadcom, is that in the three years spanning a particular optical module generation, customers have deployed two generations of switches. For example, the 3.2-terabit Tomahawk based switches and the higher-capacity Tomahawk 2 ones both use QSFP28 and SFP28 modules. 

In future, a closer alignment in the development cycles of the chip and the optics will be required, argues Broadcom.

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Cavium broadens its Xpliant switch-chip offerings

• Two families of Xpliant switch chips have been unveiled: the XP60 with sub-terabit switching capacities and the mid-range XP70 devices with 1 to 1.8 terabits of capacity.
• The switch ICs broaden the datacom and telecom markets Cavium can now address. 
• Cavium is developing a next-generation high-end switch chip but the company is not saying when it will be announced. 

Cavium has broadened its portfolio of switch chips. The two families - the XP60 and the XP70 - have smaller switch capacities than Cavium’s XP80 Xpliant family and feature architectural enhancements.

“The new chips expand Cavium’s addressable markets to include enterprise and carrier-access networks as well as mainstream cloud data centres,” says Bob Wheeler, principal analyst for networking at The Linley Group.

John Harrsen

The switch chips enable Cavium to address 25-gigabit interface switches, power-constrained enclosure designs such as blade servers, and 5G cloud radio access networks (CRAN) and GPON aggregation.

Until now Cavium has offered three XP80 Xpliant switch ICs, the largest being a 3.2-terabits switch. In contrast, the three XP70 devices have switch capacities of 1, 1.4  and 1.8 terabits while the XP60’s three chips have 280, 560 and 720 gigabits of capacity.

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