The email sent will contain a link to this article, the article title, and an article excerpt (if available). For security reasons, your IP address will also be included in the sent email.
Part 2: Odin technology
Ranovus has tested a chiplet that combines electronics and silicon photonics. Dubbed Odin 8, the monolithic design is targetting the co-packaged optics opportunity, enabling silicon chips to communicate optically.
The company is developing two such chiplets: the 800-gigabit Odin 8 and the higher-capacity Odin 32 that supports 3.2 terabits of traffic.
Hamid Arabzadeh
The first use of Odin 8 will be for 800-gigabit client-side modules. “We already have three lead customers for our 800-gigabit module business,” says Hamid Arabzadeh, CEO of Ranovus.
The 800-gigabit pluggable modules using the Odin 8 are expected to be generally available from late 2021.
Return to Article
