Open ROADM gets deployed as work starts on Release 6.0

AT&T has deployed Open ROADM technology in its network and says all future reconfigurable optical add-drop multiplexer (ROADM) deployments will be based on the standard. 

“At this point, it is in a single metro and we are working on a second large metro area,” says John Paggi, assistant vice president member of technical staff, network infrastructure and services at AT&T. 

Shown are the various elements included in the disaggregated Open ROADM MSA. Also shown is the hierarchical SDN controller architecture with the federated controllers overseeing the optical layer and the multi-layer controller overseeing the path creation across the layer, from IP to optical. Source: Open ROADM MSA

Meanwhile, the Open ROADM multi-source agreement (MSA) continues to progress, with members working on Release 6.0 of the standard. 

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COBO brings operational benefits to the data centre

Brad Booth admits the hyperscalers have a problem.

“Our operational inefficiencies are massive and it is only going to get worse,” says Booth, principal network architect for Microsoft’s Azure Infrastructure and chair of the Consortium for On-Board Optics (COBO).

The COBO-enabled 12.8-terabit demonstrator switch. Source: COBO

The issue, he says, is that when a switch arrives at the data centre, it comes without the optics installed. The operations staff must unpack the optical modules, plug them into the switch and verify that each is working; an exercise that is repeated thousands of times when they commission a new data centre.

“The time it takes for us to get the network up and running impacts how quickly we can monetise the data centre,” says Booth.

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Co-packaged optics to debut with 25.6 terabit switch chips

The second article in a series on co-packaged optics.

Part 2: Broadcom - a switch-chip vendor 

The hyperscalers require ever more switching capacity in their data centres to scale the applications they run. A hierarchy of connected switches fitted with optical interfaces is used to provide the pathways that link the tens of thousands of servers found in data centres.

Silicon vendors are responding to this need by doubling the capacity of their switch chips every two years. The largest switch chips have a 12.8-terabit capacity and the first 25.6-terabit devices are expected next year. This relentless pace, however, is one that the optical module makers are struggling to match. 

Source: Gazettabyte

“It is a problem for the optics industry,” says Robert Stone, Distinguished Engineer at leading switch chip player, Broadcom. “The cadence at which we can evolve silicon generally moves a lot faster than the optics guys can monetise a generation of investment, and then reinvest it.”

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Lumentum completes sale of certain datacom lines to CIG

Brandon Collings, CTO of Lumentum, talks CIG, 400ZR and 400ZR+, COBO, co-packaged optics and why silicon photonics is not going to change the world.

Lumentum has completed the sale of part of its datacom product lines to design and manufacturing company, Cambridge Industries Group. 

The sale will lower the company's quarterly revenues by between $20 million to $25 million. Lumentum also said that it will stop selling datacom transceivers in the next year to 18 months.

Brandon CollingsThe move highlights how fierce competition and diminishing margins from the sale of client-side modules is causing optical component companies to rethink their strategies.

Lumentum’s focus is now to supply its photonic chips to the module makers, including CIG. “From a value-add point of view, there is a lot more value in selling those chips than the modules,” says Brandon Collings, CTO of Lumentum.

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Macom readies its silicon photonics platform for 400G

• Macom has announced a laser-integrated photonic integrated circuit (L-PIC) for the 400G-FR4 standard 

• The company is also working with GlobalFoundries to use the semiconductor foundry’s 300mm wafer silicon photonics process 

Vivek Rajgarhia (centre) being interviewed at OFC. Source: Macom.

Macom has detailed its latest silicon photonics chip to meet the upcoming demand for 400-gigabit interfaces within the data centre. 

The chip, a laser-integrated photonic integrated circuit (L-PIC), was unveiled at the OFC show held last month in San Diego. The L-PIC implements the transmitter circuitry for the 400G-FR4 2km interface standard.

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Data centre interconnect drives coherent

• NeoPhotonics announced at OFC a high-speed modulator and intradyne coherent receiver (ICR) that support an 800-gigabit wavelength

• It also announced limited availability of its nano integrable tunable laser assembly (nano-ITLA)  and demonstrated its pico-ITLA, an even more compact silicon photonics-based laser assembly

• The company also showcased a CFP2-DCO pluggable

NeoPhotonics unveiled several coherent optical transmission technologies at the OFC conference and exhibition held in San Diego last month.

Ferris Lipscomb“There are two [industry] thrusts going on right now: 400ZR and data centre interconnect pizza boxes going to even higher gigabits per wavelengths,” says Ferris Lipscomb, vice president of marketing at NeoPhotonics.

The 400ZR is an interoperable 400-gigabit coherent interface developed by the Optical Internetworking Forum (OIF).

Optical module makers are developing 400ZR solutions that fit within the client-side QSFP-DD and OSFP pluggable form factors, first samples of which are expected by year-end.

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OFC interview regarding silicon photonics and our book

ADVA Optical Networking's Gareth Spence interviewed Daryl Inniss, director, new business development at OFS, and me at the OFC conference and exhibition held earlier this month in San Diego, California. We were interviewed regarding the status of silicon photonics and our book on the topic.

Click here for the interview.