The various paths to co-packaged optics

Near package optics has emerged as companies have encountered the complexities of co-packaged optics. It should not be viewed as an alternative to co-packaged optics but rather a pragmatic approach for its implementation.

Co-packaged optics will be one of several hot topics at the upcoming OFC show in March.

Placing optics next to silicon is seen as the only way to meet the future input-output (I/O) requirements of ICs such as Ethernet switches and high-end processors.

Brad Booth

For now, pluggable optics do the job of routing traffic between Ethernet switch chips in the data centre. The pluggable modules sit on the switch platform’s front panel at the edge of the printed circuit board (PCB) hosting the switch chip.

But with switch silicon capacity doubling every two years, engineers are being challenged to get data into and out of the chip while ensuring power consumption does not rise.

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Huawei sets transmission record with new modulator

Coherent discourse: Part 1

A paper from Huawei and Sun Yat-Sen University in the January issue of the Optica journal describes a thin-film lithium niobate modulator. The modulator enabled a world-record coherent optical transmission, sending nearly 2 terabits of data over a single wavelength.

Maxim Kuschnerov

Much of the industry’s focus in recent years has been to fit coherent optical technology within a pluggable module.

Such pluggables allow 400-gigabit coherent interfaces to be added to IP routers and switches, serving the needs of the data centre operators and telecom operators.

But research labs of the leading optical transport vendors continue to advance high-end coherent systems beyond 800-gigabit-per-wavelength transmissions.

Optical transport systems from Ciena, Infinera and Huawei can send 800-gigabit wavelengths using a symbol rate of 96-100 gigabaud (GBd).

Acacia Communications, part of Cisco, detailed late last year the first 1.2-terabit single-wavelength coherent pluggable transceiver that will operate at 140GBd, twice the symbol rate of 400-gigabit modules such as 400ZR. 

Now Huawei has demonstrated in the lab a thin-film lithium niobate modulator that supports a symbol rate of 220GBd and beyond.

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Intel sets a course for scalable optical input-output

• Intel is working with several universities to create building-block circuits to address its optical input-output (I/O) needs for the next decade-plus.

• By 2024 the company wants to demonstrate the technologies achieving 4 terabits-per-second (Tbps) over a fibre at 0.25 picojoules-per-bit (pJ/b).

Intel has teamed up with seven universities to address the optical I/0 needs for several generations of upcoming products.

The initiative, dubbed the Intel Research Center for Integrated Photonics for Data Centre Interconnects, began six months ago and is a three-year project.

No new location is involved, rather the research centre is virtual with Intel funding the research. By setting up the centre, Intel’s goal is to foster collaboration between the research groups.

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Marvell’s latest acquisition: switch-chip firm Innovium

• Innovium will be Marvell's fifth acquisition in four years  

Marvell is buying switch-chip maker, Innovium, for $1.1 billion to bolster its revenues from the lucrative data centre market.

Nariman Yousefi

The combination of Innovium with Inphi, Marvell’s most recent $10 billion acquisition, will enable the company to co-package optics alongside the high-bandwidth, low-latency switch chips.

“Inphi has quite a bit of experience shipping silicon photonics with the ColorZ and ColorZ II [modules],” says Nariman Yousefi, executive vice president, automotive, coherent DSP and switch group at Marvell. “And we have programmes inside the company to do co-packaged optics as well.”

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Turning to optical I/O to open up computing pinch points

Getting data in and out of chips used for modern computing has become a key challenge for designers.

Hugo Saleh

A chip may talk to a neighbouring device in the same platform or to a chip across the data centre.

The sheer quantity of data and the reaches involved - tens or hundreds of meters - is why the industry is turning to optical for a chip’s input-output (I/O).

It is this technology transition that excites Ayar Labs.

The US start-up showcased its latest TeraPHY optical I/O chiplet operating at 1 terabit-per-second (Tbps) during the OFC virtual conference and exhibition held in June.

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SiDx's use of silicon photonics for blood testing

Part 4: Biosensor start-up, SiDx

A blood sample reveals much about a person’s health. But analysing the sample is complicated given its many constituents.

Identifying a user’s blood type is also non-trivial.

If a patient arriving at hospital needs a blood transfusion, the universal donor blood type, O negative, is administered. That’s because it takes too long - 45 minutes typically - to identify the patient’s blood type. This also explains the huge demand for O negative blood.

A laser lights the waveguide causing the ring to resonate. The blood sample then flows over the ring causing constituents to bind to the receptors. A rinse stage then removes specific bound components leaving the target constituent that has a signature wavelength shift. Source: SiDx.

Identifying blood type promptly is what start-up SiDx set out to address with a platform based on a silicon photonics sensor. The resulting platform does more than just blood-type identification.

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imec’s research work to advance biosensors

Part 3: Biosensor developments

• Pol Van Dorpe discusses the institute’s use of photonics and silicon to develop new designs for medical diagnostics.
• imec has designed a breathalyser that detects the coronavirus with the accuracy of a polymerase chain reaction (PCR) test, a claimed world first.

Pol Van Dorpe, an imec Fellow

Optics and photonics are advancing medical diagnostics in two notable ways.

The technologies are helping to shrink diagnostic systems to create new types of medical devices.

"Going from big lab equipment to something much smaller is a clear trend," says Pol Van Dorpe, a Fellow at imec, the Belgium R&D nanoelectronics and nanotechnology institute.

Photonics and silicon also benefit central labs by creating more powerful test instruments. More functionality and detectors can be integrated in a given area enabling multiple tests in parallel, a technique dubbed multiplexing.

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