Terabit interconnect to take hold in the data centre

Intel and Corning have further detailed their 1.6 Terabit interface technology for the data centre.

The collaboration combines Intel's silicon photonics technology operating at 25 Gigabit-per-fibre with Corning's ClearCurve LX multimode fibre and latest MXC connector.

Silicon photonics wafer and the ClearCurve fibres. Source: Intel

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