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- An Israeli start-up is tackling a key packaging challenge for silicon photonics
Teramount has developed a way to simplify the packaging of silicon photonics chips. Instead of using active alignment whereby an external laser is required to carefully align a fibre to the optical die, the Israeli start-up has developed a technology that allows passive alignment.
Hesham Taha“If we want silicon photonics to ramp up to volume, it has to meet CMOS standards both in terms of fabrication and packaging,” says Hesham Taha, Teramount's CEO.
Taha worked at a company developing atomic force microscopy systems before co-founding Teramount. "We got to know of the problem of injecting light into a waveguide and were surprised that the industry was still using active alignment," he says.
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