Published book, click here
Friday, October 21, 2011 at 6:31AM Gazettabyte spoke with Tim Jenks, CEO of NeoPhotonics about the Santur acquisition, the 10x10 MSA, vertical integration and why optical components is a technology industry trend-setter
NeoPhotonics has completed the acquisition of Santur, the tunable laser and photonic integration specialist, boosting the company's annual turnover to a quarter of a billion dollars.
Thursday, September 15, 2011 at 8:43AM Infinera has announced a core network platform that combines Optical Transport Network (OTN) switching with dense wavelength division multiplexing (DWDM) transport. "We are looking at a system that integrates two layers of the network," says Mike Capuano, vice president of corporate marketing at Infinera.
"This is 100Tbps of non-blocking switching, all functioning as one system. You just can't do that with merchant silicon."
Mike Capuano, Infinera
Friday, March 11, 2011 at 11:53AM What has been announced?
Infinera has detailed Terabit coherent detection photonic integrated circuits (PICs). The pair - a transmitter and a receiver PIC – implement a ten-channel 100 Gigabit-per-second (Gbps) link using polarisation multiplexing quadrature phase-shift keying (PM-QPSK). The Infinera development work was describe in papers given at the OFC/NFOEC event held in Los Angeles.
Infinera recently demonstrated its 5x100Gbps PIC carrying traffic within Interoute Communications’ network. The 5x100Gbps PIC-based system will be available commercially in 2012.
“We think we can drive the system from where it is today – 8 Terabits-per-fibre - to around 25 Terabits-per-fibre”
Dave Welch, Infinera
Wednesday, October 13, 2010 at 9:13AM In the first of a two-part interview, Rafik Ward, vice president of marketing at Finisar, talks about 40 and 100 Gigabit optics, emerging market opportunities and why this is the best time for a decade to be in the optical components industry.
"This is probably the strongest growth we have seen since the last bubble of 1999-2000." Rafik Ward, Finisar
Tuesday, September 7, 2010 at 6:48AM Significant power, size and cost challenges must be overcome before WDM-PON will be widely deployed.
"We see just one way to bring down the cost, form-factor and energy consumption of the OLT’s multiple transceivers: high integration of transceiver arrays"
Klaus Grobe, ADVA Optical Networking
Considerable engineering effort will be needed to make next-generation optical access schemes using multiple wavelengths competitive with existing passive optical networks (PONs).
Such a multi-wavelength access scheme, known as a wavelength division multiplexing-passive optical network (WDM-PON), will need to embrace new architectures based on laser arrays and reflective optics, and use advanced photonic integration to meet the required size, power consumption and cost targets.
Wednesday, February 17, 2010 at 8:59AM Kotura has detailed a compact, low-power silicon-based optical modulator; an important building block to enable dense on-chip optical interconnects. The modulator operates at up to 11Gbit/s, consumes 0.5mW and has an area of 1000µm2.
This is the silicon photonic start-up’s first announced modulator. The design has been developed in conjunction with Sun Microsystems as part of the DAPRA Ultraperformance Nanophotonic Intrachip Communications (UNIC) programme.
An image of the modulator and a cross-section diagram of the ring waveguide. Source: Kotura
Tuesday, November 17, 2009 at 8:45AM I have added a mind map summarising the photonic integration feature
To download the full mind map in .pdf form, click here.
