What has been announced?
Infinera has given first detail of its terabit coherent detection photonic integrated circuits (PICs). The pair - a transmitter and a receiver PIC – implement a ten-channel 100 Gigabit-per-second (Gbps) link using polarisation multiplexing quadrature phase-shift keying (PM-QPSK). The Infinera development work was detailed at OFC/NFOEC held in Los Angeles between March 6-10.
Infinera has recently demonstrated its 5x100Gbps PIC carrying traffic between Amsterdam and London within Interoute Communications’ pan-European network. The 5x100Gbps PIC-based system will be available commercially in 2012.
“We think we can drive the system from where it is today – 8 Terabits-per-fibre - to around 25 Terabits-per-fibre”
Dave Welch, Infinera
Why is this significant?
The widespread adoption of 100Gbps optical transport technology will be driven by how quickly its cost can be reduced to compete with existing 40Gbps and 10Gbps technologies.
Whereas the industry is developing 100Gbps line cards and optical modules, Infinera has demonstrated a 5x100Gbps coherent PIC based on 50GHz channel spacing while its terabit PICs are in the lab.
If Infinera meets its manufacturing plans, it will have a compelling 100Gbps offering as it takes on established 100Gbps players such as Ciena. Infinera has been late in the 40Gbps market, competing with its 10x10Gbps PIC technology instead.
40 and 100 Gigabit
Infinera views 40Gbps and 100Gbps optical transport in terms of the dynamics of the high-capacity fibre market. In particular what is the right technology to get most capacity out of a fibre and what is the best dollar-per-Gigabit technology at a given moment.
For the long-haul market, Dave Welch, chief strategy officer at Infinera, says 100Gbps provides 8 Terabits (Tb) of capacity using 80 channels versus 3.2Tb using 40Gbps (80x40Gbps). The 40Gbps total capacity can be doubled to 6.4Tb (160x40Gbps) if 25GHz-spaced channels are used, which is Infinera’s approach.
“The economics of 100 Gigabit appear to be able to drive the dollar-per-gigabit down faster than 40 Gigabit technology,” says Welch. If operators need additional capacity now, they will adopt 40Gbps, he says, but if they have spare capacity and can wait till 2012 they can use 100Gbps. “The belief is that they [operators] will get more capacity out of their fibre and at least the same if not better economics per gigabit [using 100Gbps],” says Welch. Indeed Welch argues that by 2012, 100Gbps economics will be superior to 40Gbps coherent leading to its “rapid adoption”.
For metro applications, achieving terabits of capacity in fibre is less of a concern. What matters is matching speeds with services while achieving the lowest dollar-per-gigabit. And it is here – for sub-1000km networks – where 40Gbps technology is being mostly deployed. “Not for the benefit of maximum fibre capacity but to protect against service interfaces,” says Welch, who adds that 40 Gigabit Ethernet (GbE) rather than 100GbE is the preferred interface within data centres.
Shorter-reach 100Gbps
Companies such as ADVA Optical Networking and chip company MultiPhy highlight the merits of an additional 100Gbps technology to coherent based on direct detection modulation for metro applications (for a MultiPhy webinar on 100Gbps direct detection, click here). Direct detection is suited to distances from 80km up to 1000km, to connect data centres for example.
Is this market of interest to Infinera? “This is a great opportunity for us,” says Welch.
The company’s existing 10x10Gbps PIC can address this segment in that it is least 4x cheaper than emerging 100Gbps coherent solutions over the next 18 months, says Welch, who claims that the company’s 10x10Gbps PIC is making ‘great headway’ in the metro.
“If the market is not trying to get the maximum capacity but best dollar-per-gigabit, it is not clear that full coherent, at least in discrete form, is the right answer,” says Welch. But the cost reduction delivered by coherent PIC technology does makes it more competitive for cost-sensitive markets like metro.
A 100Gbps coherent discrete design is relatively costly since it requires two lasers (one as a local oscillator (LO - see fig 1 - at the receiver), sophisticated optics and a high power-consuming digital signal processor (DSP). “Once you go to photonic integration the extra lasers and extra optics, while a significant engineering task, are not inhibitors in terms of the optics’ cost.”
Coherent PICs can be used ‘deeper in the network’ (closer to the edge) while shifting the trade-offs between coherent and on-off keying. However even if the advent of a PIC makes coherent more economical, the DSP’s power dissipation remains a factor regarding the tradeoff at 100Gbps line rates between on-off keying and coherent.
Welch does not dismiss the idea of Infinera developing a metro-centric PIC to reduce costs further. He points out that while such a solution may be of particular interest to internet content companies, their networks are relatively simple point-to-point ones. As such their needs differ greatly from cable operators and telcos, in terms of the services carried and traffic routing.
PIC challenges
Figure 1: Infinera's terabit PM-QPSK coherent receiver PIC architecture
There are several challenges when developing multi-channel 100Gbps PICs. “The most difficult thing going to a coherent technology is you are now dealing with optical phase,” says Welch. This requires highly accurate control of the PIC’s optical path lengths.
The laser wavelength is 1.5 micron and with the PIC's indium phosphide waveguides this is reduced by a third to 0.5 micron. Fine control of the optical path lengths is thus required to tenths of a wavelength or tens of nanometers (nm).
Achieving a high manufacturing yield of such complex PICs is another challenge. The terabit receiver PIC detailed in the OFC paper integrates 150 optical components, while the 5x100Gbps transmit and receive PIC pair integrate the equivalent of 600 optical components.
Moving from a five-channel (500Gbps) to a ten-channel (terabit) PIC is also a challenge. There are unwanted interactions in terms of the optics and the electronics. “If I turn one laser on adjacent to another laser it has a distortion, while the light going through the waveguides has potential for polarisation scattering,” says Welch. “It is very hard.”
But what the PICs shows, he says, is that Infinera’s manufacturing process is like a silicon fab’s. “We know what is predictable and the [engineering] guys can design to that,” says Welch. “Once you have got that design capability, you can envision we are going to do 500Gbps, a terabit, two terabits, four terabits – you can keep on marching as far as the gigabits-per-unit [device] can be accomplished by this technology.”
The OFC post-deadline paper details Infinera's 10-channel transmitter PIC which operates at 10x112Gbps or 1.12Tbps.
Power dissipation
The optical PIC is not what dictates overall bandwidth achievable but rather the total power dissipation of the DSPs on a line card. This is determined by the CMOS process used to make the DSP ASICs, whether 65nm, 40nm or potentially 28nm.
Infinera has not said what CMOS process it is using. What Infinera has chosen is a compromise between “being aggressive in the industry and what is achievable”, says Welch. Yet Infinera also claims that its coherent solution consumes less power than existing 100Gbps coherent designs, partly because the company has implemented the DSP in a more advanced CMOS node than what is currently being deployed. This suggests that Infinera is using a 40nm process for its coherent receiver ASICs. And power consumption is a key reason why Infinera is entering the market with a 5x100Gbps PIC line card. For the terabit PIC, Infinera will need to move its ASICs to the next-generation process node, he says.
Having an integrated design saves power in terms of the speeds that Infinera runs its serdes (serialiser/ deserialiser) circuitry and the interfaces between blocks. “For someone else to accumulate 500Gbps of bandwdith and get it to a switch, this needs to go over feet of copper cable, and over a backplane when one 100Gbps line card talks to a second one,” says Welch. “That takes power - we don’t; it is all right there within inches of each other.”
Infinera can also trade analogue-to-digital (A/D) sampling speed of its ASIC with wavelength count depending on the capacity required. “Now you have a PIC with a bank of lasers, and FlexCoherent allows me to turn a knob in software so I can go up in spectral efficiency,” he says, trading optical reach with capacity. FlexCoherent is Infinera’s technology that will allow operators to choose what coherent optical modulation format to use on particular routes. The modulation formats supported are polarisation multiplexed binary phase-shift keying (PM-BPSK) and PM-QPSK.
Dual polarisation 25Gbaud constellation diagrams
What next?
Infinera says it is an adherent of higher quadrature amplitude modulation (QAM) rates to increase the data rate per channel beyond 100Gbps. As a result FlexCoherent in future will enable the selection of higher-speed modulation schemes such as 8-QAM and 16-QAM. “We think we can drive the system from where it is today –8 Terabits-per-fibre - to around 25 Terabits-per-fiber.”
But Welch stresses that at 16-QAM and even higher level speeds must be traded with optical reach. Fibre is different to radio, he says. Whereas radio uses higher QAM rates, it compensates by increasing the launch power. In contrast there is a limit with fibre. “The nonlinearity of the fibre inhibits higher and higher optical power,” says Welch. “The network will have to figure out how to accommodate that, although there is still significant value in getting to that [25Tbps per fibre]” he says.
The company has said that its 500 Gigabit PIC will move to volume manufacturing in 2012. Infinera is also validating the system platform that will use the PIC and has said that it has a five terabit switching capacity.
Infinera is also offering a 40Gbps coherent (non-PIC-based) design this year. “We are working with third-party support to make a module that will have unique performance for Infinera,” says Welch.
The next challenge is getting the terabit PIC onto the line card. Based on the gap between previous OFC papers to volume manufacturing, the 10x100Gbps PIC can be expected in volume by 2014 if all goes to plan.