Professor Graham Reed: The calm before the storm

Silicon photonics luminaries series

Interview 3: Professor Graham Reed

Despite a half-century track record driving technology, electronics is increasingly calling upon optics for help. “It seems to me that this is a marriage that is really going to define the future,” says Graham Reed, professor of silicon photonics at the University of Southampton’s Optoelectronics Research Centre.

The optics alongside the electronics does not have to be silicon photonics, he says, but silicon as a photonics technology is attractive for several reasons. 

“What makes silicon photonics interesting is its promise to enable low-cost manufacturing, an important requirement for emerging consumer applications,” says Reed. And being silicon-based, it is much more compatible than other photonics technologies. “It probably means silicon photonics is going to win out,” he says. 

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Ciena shops for photonic technology for line-side edge

Briefing: DWDM developments

Part 3: Acquisitions and silicon photonics

Ciena is to acquire the high-speed photonics components division of Teraxion for $32 million. The deal includes 35 employees and Teraxion’s indium phosphide and silicon photonics technologies. The systems vendor is making the acquisition to benefit its coherent-based packet-optical transmission systems in metro and long-haul networks.

Sterling Perrin

“Historically Ciena has been a step ahead of others in introducing new coherent capabilities to the market,” says Ron Kline, principal analyst, intelligent networks at market research company, Ovum. “The technology is critical to own if they want to maintain their edge.”

“Bringing in-house not everything, just piece parts, are becoming differentiators,” says Sterling Perrin, senior analyst at Heavy Reading.    

Ciena designs its own WaveLogic coherent DSP-ASICs but buys its optical components. Having its own photonics design team with expertise in indium-phosphide and silicon photonics will allow Ciena to develop complete line-side systems, optimising the photonics and electronics to benefit system performance.

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ECOC 2015 Review - Part 1

Part 1: Line side announcements

• Several companies announced components for 400 gigabit optical transmission
• NEL announced a 200 gigabit coherent DSP-ASIC
• Lumentum ramps production of its ROADM blades while extending the operating temperature of its tunable SFP+

400 gigabit

Oclaro, Teraxion and NeoPhotonics detailed their latest optical components for 400 gigabit optical transmission using coherent detection.

Oclaro and Teraxion announced 400 gigabit modulators for line-side transmission; Oclaro’s based on lithium niobate and Teraxion’s an indium phosphide one.

NeoPhotonics outlined other components that will be required for higher-speed transmission: indium phosphide-based waveguide photo-detectors for coherent receivers, and ultra-narrow line-width lasers suited for higher order modulation schemes such as dual-polarisation 16-quadrature amplitude modulation (DP-16-QAM) and DP-64-QAM.

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ECOC 2015: Reflections

Gazettabyte asked industry executives what trends and highlights they noted at the recent European Conference on Optical Communication (ECOC) event, held in Valencia. Here are three views.

Valery Tolstikhin, head of a design consultancy, Intengent

ECOC was a big show and included a number of satellite events, such as the 6^th European Forum on Photonic Integration, the 3^rd Optical Interconnect in Data Center Symposium and Market Focus, all of which I attended. So, lots of information to digest. 

My focus was mainly on data centre optical interconnects and photonic integration.

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US invests $610 million to spur integrated photonics

The US government has set up its latest manufacturing initiative, the sixth of nine, to address photonic integrated circuits (PICs). The $610 million venture is a combination of public and private funding: $110 million from the Department of Defense, $250 million from the state of New York and the rest private contributions.

Prof. Duncan Moore

Dubbed the American Institute for Manufacturing Integrated Photonics (AIM Photonics), the venture has attracted 124 partners includes 20 universities and over 50 companies.

The manufacturing innovation institute will be based in Rochester, New York, and will be led by the Research Foundation for the State University of New York. A key goal is that the manufacturing institute will continue after the initiative is completed in early 2021.

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Verizon tips silicon photonics as a key systems enabler

Verizon's director of optical transport network architecture and design, Glenn Wellbrock, shares the operator’s thoughts regarding silicon photonics.

Part 3: An operator view

Glenn Wellbrock is upbeat about silicon photonics’ prospects. Challenges remain, he says, but the industry is making progress. “Fundamentally, we believe silicon photonics is a real enabler,” he says. “It is the only way to get to the densities that we want.”

Glenn Wellbrock

Wellbrock adds that indium phosphide-based photonic integrated circuits (PICs) can also achieve such densities.

But there are many potential silicon photonics suppliers because of its relatively low barrier to entry, unlike indium phosphide. "To date, Infinera has been the only real [indium phosphide] PIC company and they build only for their own platform,” says Wellbrock.

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Silicon photonics economics set to benefit III-V photonics

Silicon photonics promises to deliver cheaper optical components using equipment, processes and fabrication plants paid for by the chip industry. Now, it turns out, traditional optical component players using indium phosphide and gallium arsenide can benefit from similar economies, thanks to the wireless IC chip industry.

Valery TolstikhinSilicon photonics did a good thing; it turned the interest of the photonics industry to the operational ways of silicon 

So argues Valery Tolstikhin, head of a design consultancy and former founder and CTO of Canadian start-up OneChip Photonics. The expectations for silicon photonics may still to be fulfilled, says Tolstikhin, but what the technology has done is spark interest in the economics of component making. And when it comes to chip economics, volumes count.

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