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- DustPhotonics has raised $24 million in funding.
- The start-up has taped out its 200 gigabit-per-lane optical chip.
- DustPhotonics expects the 1.6-terabit module market to ramp, starting year-end.
Ronnen Lovinger
DustPhotonics, which develops chips for transmit optical sub-assemblies (TOSAs) for 400 and 800-gigabit pluggable optical modules, has raised $24 million. The funding extends its Series B funding round.
"When you start ramping up products, you have to iron out the creases around supply chain, production, and everything else," says Ronnen Lovinger, CEO of DustPhotonics.
DustPhotonics has several customers and a backlog of orders for its 400 and 800-gigabit photonic integrated circuits (PICs). The company has also taped out its 200 gigabit-per-lane chip and will have products later this year.
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